Cheerise Circuits supports HDI PCB manufacturing for compact, high-density electronic designs that need fine features, laser-drilled microvias, and a controlled production route. Our published capability lists HDI structures from 1+N+1 and 1+1+N+1+1 in mass production, with sample capability including 2+N+2, 3+N+3, and ELIC HDI boards. Final stack-up, build-up sequence, material, and lead time are confirmed against the actual design data.
HDI PCB Capability at a Glance
| Item | Mass production | Sample / prototype |
|---|---|---|
| HDI structures | 1+N+1; 1+1+N+1+1 | 2+N+2; 3+N+3; ELIC HDI boards |
| Maximum layer count | 20 layers | 38 layers |
| Minimum track width / space | 3.5 mil / 3.5 mil | 2.5 mil / 2.5 mil |
| Minimum mechanical drill size | 0.20 mm | 0.15 mm |
| Minimum laser drill size | 0.10 mm | 0.076 mm |
These figures are a capability reference. The feasible HDI construction depends on the layer stack-up, via type, copper construction, material system, routing geometry, reliability requirements, quantity, and inspection scope.
What to Include in an HDI PCB RFQ
HDI builds benefit from a complete engineering input package before quotation. Please provide:
- Gerber RS-274X files and the required quantity
- Layer stack-up, material requirements, board thickness, copper weight, and surface finish
- HDI build-up sequence, via types, microvia requirements, and any filled, capped, blind, or buried-via notes
- Impedance, controlled-net, test, panelization, and inspection requirements where applicable
- Special packaging, delivery, or documentation requirements
For a combined HDI PCB assembly project, please also include the BOM, pick-and-place data, assembly drawing, and test requirements.
Engineering Review for HDI Builds
HDI PCB manufacturing is not defined by one minimum drill number. The stack-up, build-up sequence, copper distribution, via design, feature spacing, material selection, surface finish, and inspection plan work together. Before release, Cheerise Circuits reviews the design inputs and confirms a feasible process route with the quotation. Questions are addressed before fabrication so the production plan reflects the agreed design intent.
Quality and Inspection Support
Our published quality process includes incoming material inspection, in-process checks during drilling, plating, etching, and solder-mask stages, plus final electrical testing where applicable. AOI and manual visual inspection support the agreed project requirements. Review our PCB quality and manufacturing capability page for the full published capability table and process overview.
Related PCB Manufacturing Support
- PCB manufacturing and assembly services
- Controlled impedance PCB manufacturing
- PCB assembly services
- PCB manufacturing FAQ
Request an HDI PCB Quote
Send your Gerber files, stack-up, HDI structure requirements, quantity, and delivery needs. Cheerise Circuits will review the project and provide a quotation with the feasible manufacturing route and schedule.
Request a quote from Cheerise Circuits.
Frequently Asked Questions
What HDI structures can Cheerise Circuits support?
The published capability lists 1+N+1 and 1+1+N+1+1 structures for mass production. Sample capability includes 2+N+2, 3+N+3, and ELIC HDI boards. The final construction is confirmed from the actual stack-up and design data.
What is the published minimum laser-drill capability?
Cheerise Circuits lists a minimum laser drill size of 0.10 mm for mass production and 0.076 mm for samples. Feasibility depends on the complete HDI design and process route.
What information is needed for an HDI PCB quote?
Gerber files, quantity, stack-up, material, board thickness, copper weight, surface finish, HDI build-up sequence, via requirements, controlled-net requirements, and inspection notes are the most useful inputs for an HDI PCB quotation.